METAL/ALLOY DESIGNATION |
BASIC COMPOSITION |
| CC - 150 SERIES | 99.99wt% Au. |
| CC - 250 SERIES | Al - 1wt% Si. |
| CC - 350 SERIES | 99.99wt% Al. |
| CC - 450 SERIES | Al - 0.5wt% Mg. |
DESIGNATIONS |
DESCRIPTION AND APPLICATION |
| CC -150 | Medium strength, all-purpose, fine diameter gold bonding wire suitable for most conventional applications. |
| CC - 151 | High strength, fine diameter gold bonding wire for long and/or low loop applications. |
| CC - 250 | Fine diameter, Al - 1% Si bonding wire for hermetic ( eg. CERDIP) and Glob-top (C.O.B) devices. |
| CC - 350 | Large diameter, 99.99% Al bonding wire for conventional power devices. |
| CC - 351 | Large diameter, corrosion-resistant, 99.99% Al bonding wire for non-hermetic power applications. Contains 50 ppm Ni. |
| CC - 450 | Medium diameter, Al - 0.5% Mg bonding wire for power devices. |
| CC - 451 | Medium diameter, Al - 0.5% Mg - 0.1% Pd bonding wire for power devices. The Pd additive provides corrosion inhibition. |